Numerous studies have shown that datacenter computers rarely operate at full utilization, leading to a number of proposals for creating servers that are energy proportional with r...
Dennis Abts, Michael R. Marty, Philip M. Wells, Pe...
The Spidergon interconnection network has become popular recently in multiprocessor systems on chips. To the best of our knowledge, algorithms for collective communications (CC) h...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
Abstract. The topological design of distributed packet switched networks consists of finding a topology that minimizes the communication costs by taking into account a certain num...
As the level of chip integration continues to advance at a fast pace, the desire for efficient interconnects-whether on-chip or off-chip--is rapidly increasing. Traditional interc...