So far, performance and reliability of circuits have been determined by worst-case characterization of silicon and environmental noise. As new deep sub-micron technologies exacerb...
Static timing analysis is a critical step in design of any digital integrated circuit. Technology and design trends have led to significant increase in environmental and process v...
SRAM design has been a major challenge for nanoscale manufacturing technology. We propose a new bit cell repair scheme for designing maximum-information memory system (MIMS). Unli...
A low-power frequency multiplication technique, developed for ZigBee (IEEE 802.15.4) like applications is presented. We have provided an estimate for the power consumption for a g...
Jagdish Nayayan Pandey, Sudhir S. Kudva, Bharadwaj...
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...