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160
Voted
CF
2009
ACM
15 years 10 months ago
2009
ACM
In this paper, we compare the architectural perspectives of the Wave Field Synthesis (WFS) 3D-audio algorithm mapped on three different platforms: a General Purpose Processor (GP...
109
Voted
ASPDAC
2012
ACM
13 years 11 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
107
Voted
ISCAS
2006
IEEE
15 years 9 months ago
2006
IEEE
We fabricated a 3D-integrated multi-chip sensor separate dies [9]. In this paper, we present a 3D integrated and actuator and demonstrated the ability of communication with tempera...
129
Voted
ISCA
2008
IEEE
15 years 10 months ago
2008
IEEE
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core / SoC systems in deep sub-micron tech...
132
Voted
ICCAD
2009
IEEE
15 years 1 months ago
2009
IEEE
We propose a layout-driven test-architecture design and optimization technique for core-based system-on-chips (SoCs) that are fabricated using three-dimensional (3D) integration. ...