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» Quasi-Resonant Interconnects: A Low Power Design Methodology
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DATE
2009
IEEE
155views Hardware» more  DATE 2009»
14 years 2 months ago
Dynamic thermal management in 3D multicore architectures
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
Ayse Kivilcim Coskun, José L. Ayala, David ...
DAC
2004
ACM
14 years 9 months ago
Reliability-driven layout decompaction for electromigration failure avoidance in complex mixed-signal IC designs
The negative effect of electromigration on signal and power line lifetime and functional reliability is an increasingly important problem for the physical design of integrated cir...
Goeran Jerke, Jürgen Scheible, Jens Lienig
CODES
2003
IEEE
14 years 1 months ago
Security wrappers and power analysis for SoC technologies
Future wireless internet enabled devices will be increasingly powerful supporting many more applications including one of the most crucial, security. Although SoCs offer more resi...
Catherine H. Gebotys, Y. Zhang
ISCA
2008
IEEE
201views Hardware» more  ISCA 2008»
13 years 8 months ago
iDEAL: Inter-router Dual-Function Energy and Area-Efficient Links for Network-on-Chip (NoC) Architectures
Network-on-Chip (NoC) architectures have been adopted by a growing number of multi-core designs as a flexible and scalable solution to the increasing wire delay constraints in the...
Avinash Karanth Kodi, Ashwini Sarathy, Ahmed Louri
DATE
2008
IEEE
116views Hardware» more  DATE 2008»
14 years 2 months ago
A Virtual Prototype for Bluetooth over Ultra Wide Band System Level Design
The industry is merging two different Wireless Personal Area Networks (WPAN) technologies: Bluetooth (BT) and WiMedia Ultra Wide Band (UWB), into a single BT over UWB (BToUWB) spe...
Alexandre Lewicki, Javier del Prado Pavon, Jacky T...