3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
While the dynamic voltage scaling (DVS) techniques are efficient in reducing the dynamic energy consumption for the processor, varying voltage alone becomes less effective for t...
The recent paradigm shift to multi-core systems results in high system throughput within a specified power budget. However, future systems still require good single thread perfor...
This paper addresses the problem of extending the lifetime of a batterypowered mobile host in a client-server wireless network by using task migration and remote processing. This ...
In the near future, Ambient Intelligence (AmI) will become part of everyday life. Combining feature-rich multimedia with AmI (dubbed Ambient Multimedia for short) has the potentia...