4 search results - page 1 / 1 » Reducing Cross-Coupling Among Interconnect Wires in Deep-Sub... |
DAC
1999
ACM
14 years 3 months ago
1999
ACM
As the CMOS technology enters the deep submicron design era, the lateral inter-wire coupling capacitance becomes the dominant part of load capacitance and makes RC delay on the bu...
ISQED
2002
IEEE
14 years 3 months ago
2002
IEEE
As the process technology advances into the deep submicron era, interconnect plays a dominant role in determining circuit performance. Buffer insertion/sizing and wire sizing are ...
TC
2008
13 years 10 months ago
2008
On-chip interconnection networks (OCINs) have emerged as a modular and scalable solution for wire delay constraints in deep submicron VLSI design. OCIN research has shown that the ...
DAC
2002
ACM
14 years 11 months ago
2002
ACM
The design of high-throughput large-state Viterbi decoders relies on the use of multiple arithmetic units. The global communication channels among these parallel processors often ...