282 search results - page 21 / 57 » Reliability- and process-variation aware design of integrate... |
FTEDA
2008
13 years 9 months ago
2008
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...
FPGA
2007
ACM
14 years 3 months ago
2007
ACM
Variations in the semiconductor fabrication process results in variability in parameters between transistors on the same die, a problem exacerbated by lithographic scaling. The re...
GECCO
2007
Springer
14 years 3 months ago
2007
Springer
In this paper, a new method for evolving simple electronic circuits is discussed, with the aim of improving the reliability and performance of basic circuit blocks. Next-generatio...
DAC
2006
ACM
14 years 10 months ago
2006
ACM
In this paper, we propose a new linear programming based timing driven placement framework for high performance designs. Our LP framework is mainly net-based, but it takes advanta...
ISPD
2007
ACM
13 years 10 months ago
2007
ACM
When VLSI technology scales toward 45nm, the lithography wavelength stays at 193nm. This large gap results in strong refractive effects in lithography. Consequently, it is a huge...