Chips manufactured in 90 nm technology have shown large parametric variations, and a worsening trend is predicted. These parametric variations make circuit optimization difficult ...
Jinjun Xiong, Vladimir Zolotov, Natesan Venkateswa...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Metastability is a phenomenon that can cause system failures in digital circuits. It may occur whenever signals are being transmitted across asynchronous or unrelated clock domain...
Parallel processors such as SIMD computers have been successfully used in various areas of high performance image and data processing. Due to their characteristics of highly regula...
Abstract. Ubiquitous embedded computing systems expected to reliably perform one or more relevant tasks need design and verification methods currently not available. New envisioned...