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MEMICS
2010
13 years 3 months ago
Monitoring and Control of Temperature in Networks-on-Chip
Abstract. Increasing integration densities and the emergence of nanotechnology cause issues related to reliability and power consumption to become dominant factors for the design o...
Tim Wegner, Claas Cornelius, Andreas Tockhorn, Dir...
DAC
2003
ACM
14 years 2 months ago
Test application time and volume compression through seed overlapping
We propose in this paper an extension on the Scan Chain Concealment technique to further reduce test time and volume requirement. The proposed methodology stems from the architect...
Wenjing Rao, Ismet Bayraktaroglu, Alex Orailoglu
DAC
2001
ACM
14 years 10 months ago
A True Single-Phase 8-bit Adiabatic Multiplier
This paper presents the design and evaluation of an 8-bit adiabatic multiplier. Both the multiplier core and its built-in self-test logic have been designed using a true single-ph...
Suhwan Kim, Conrad H. Ziesler, Marios C. Papaefthy...
ISPD
2010
ACM
195views Hardware» more  ISPD 2010»
14 years 3 months ago
Density gradient minimization with coupling-constrained dummy fill for CMP control
In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...
Huang-Yu Chen, Szu-Jui Chou, Yao-Wen Chang
ICCAD
2006
IEEE
119views Hardware» more  ICCAD 2006»
14 years 5 months ago
Post-placement voltage island generation
High power consumption will shorten battery life for handheld devices and cause thermal and reliability problems. One way to lower the dynamic power consumption is to reduce the s...
Royce L. S. Ching, Evangeline F. Y. Young, Kevin C...