Although simulation remains an important part of application-specific integrated circuit (ASIC) validation, hardware-assisted parallel verification is becoming a larger part of the...
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
Clock network is a vulnerable victim of variations as well as a main power consumer in many integrated circuits. Recently, link-based non-tree clock network attracts people's...
he significant increase in the available computational power that took place in recent decades has been accompanied by a growing interest in the application of the evolutionary ap...
Skin effect makes interconnect resistance and inductance frequency dependent. This paper addresses the problem of efficiently estimating the signal characteristics of any RLC netw...