In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
The architectural study of wireless communication systems typically requires simulations with high-level models for different analog and RF blocks. Among these blocks, frequency-t...
We introduce a new method of verifying the timing of custom CMOS circuits. Due to the exponential number of patterns required, traditional simulation methods are unable to exhaust...
There is a growing concern about timing errors resulting from design marginalities and the effects of circuit aging on speed-paths in logic circuits. This paper presents a low ove...
-We propose a method involvingselectivesignalgating to minimize power dissipation in current-mode CMOS analog and multiple-valued logic (MVL) circuits employing a stack of current ...