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DATE
2009
IEEE
113views Hardware» more  DATE 2009»
15 years 10 months ago
New simulation methodology of 3D surface roughness loss for interconnects modeling
— As clock frequencies exceed giga-Hertz, the extra power loss due to conductor surface roughness in interconnects and packagings is more evident and thus demands a proper accou...
Quan Chen, Ngai Wong
ISQED
2007
IEEE
106views Hardware» more  ISQED 2007»
15 years 10 months ago
Passive Modeling of Interconnects by Waveform Shaping
In this paper, we propose a new approach to enforcing the passivity of a reduced system of general passive linear time invariant circuits. Instead of making the reduced models pas...
Boyuan Yan, Pu Liu, Sheldon X.-D. Tan, Bruce McGau...
ICCAD
2008
IEEE
147views Hardware» more  ICCAD 2008»
16 years 19 days ago
Overlay aware interconnect and timing variation modeling for double patterning technology
— As Double Patterning Technology (DPT) becomes the only solution for 32-nm lithography process, we need to investigate how DPT affects the performance of a chip. In this paper, ...
Jae-Seok Yang, David Z. Pan
ICCAD
1997
IEEE
91views Hardware» more  ICCAD 1997»
15 years 8 months ago
Interconnect layout optimization under higher-order RLC model
In this paper, we study the interconnect layout optimization problem under a higher-order RLC model to optimize not just delay, but also waveform for RLC circuits with non-monoton...
Jason Cong, Cheng-Kok Koh
139
Voted
DATE
2010
IEEE
140views Hardware» more  DATE 2010»
15 years 8 months ago
Variation-aware interconnect extraction using statistical moment preserving model order reduction
—1 In this paper we present a stochastic model order reduction technique for interconnect extraction in the presence of process variabilities, i.e. variation-aware extraction. It...
Tarek A. El-Moselhy, Luca Daniel