76 search results - page 6 / 16 » Spatially distributed 3D circuit models |
MICRO
2009
IEEE
14 years 2 months ago
2009
IEEE
Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures...
ICCAD
2005
IEEE
14 years 4 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
SMI
2006
IEEE
14 years 1 months ago
2006
IEEE
This paper presents a novel 3D shape descriptor "The Generalized Shape Distributions" for effective shape matching and analysis, by taking advantage of both local and gl...
ICPR
2004
IEEE
14 years 8 months ago
2004
IEEE
This paper proposes two indicators for predicting the quality of camera model parameters from a set of input images. The first indicator is based on the acutance. It can quickly i...
ICIP
2006
IEEE
14 years 9 months ago
2006
IEEE
We present a novel 3D model-based distributed video coding algorithm. It is based on independent, model-based tracking of multiple sources and distributed coding of the tracked fe...