The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
9, IO]. However, unlike the case with static timing, it is not so easy We show how recent advances in the handling of correlated interval representations of range uncertainty can b...
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
The use of multiple supply voltages for energy and average power reduction is well researched and several works have appeared in the literature. However, in low power design using...
Saraju P. Mohanty, N. Ranganathan, Sunil K. Chappi...
It is widely accepted that the disproportionate scaling of transistor and conventional on-chip interconnect performance presents a major barrier to future high performance systems...