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DAC
2007
ACM
14 years 10 months ago
An Integer Linear Programming Based Routing Algorithm for Flip-Chip Design
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
Jia-Wei Fang, Chin-Hsiung Hsu, Yao-Wen Chang
ICCAD
2004
IEEE
147views Hardware» more  ICCAD 2004»
14 years 6 months ago
Interval-valued reduced order statistical interconnect modeling
9, IO]. However, unlike the case with static timing, it is not so easy We show how recent advances in the handling of correlated interval representations of range uncertainty can b...
James D. Ma, Rob A. Rutenbar
GLVLSI
2009
IEEE
189views VLSI» more  GLVLSI 2009»
14 years 4 months ago
High-performance, cost-effective heterogeneous 3D FPGA architectures
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
Roto Le, Sherief Reda, R. Iris Bahar
GLVLSI
2003
IEEE
119views VLSI» more  GLVLSI 2003»
14 years 3 months ago
Simultaneous peak and average power minimization during datapath scheduling for DSP processors
The use of multiple supply voltages for energy and average power reduction is well researched and several works have appeared in the literature. However, in low power design using...
Saraju P. Mohanty, N. Ranganathan, Sunil K. Chappi...
MICRO
2003
IEEE
109views Hardware» more  MICRO 2003»
14 years 3 months ago
TLC: Transmission Line Caches
It is widely accepted that the disproportionate scaling of transistor and conventional on-chip interconnect performance presents a major barrier to future high performance systems...
Bradford M. Beckmann, David A. Wood