A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. Howeve...
Sandro Sawicki, Gustavo Wilke, Marcelo O. Johann, ...
– In the sub-65 nm CMOS technologies, subthreshold and gate dielectric leakage currents need to be simultaneously suppressed for effective energy reduction. New low-leakage circu...
We present a new timing driven method for global placement. Our method is based on the observation that similar net length reductions in the different nets that make up a path may...
The advent of portable and high-density devices has made power consumption a critical design concern. In this paper, we address the problem of reducing power consumption via gate-...
This paper presents methods for efficient power minimization at circuit and micro-architectural levels. The potential energy savings are strongly related to the energy profile of ...
Robert W. Brodersen, Mark Horowitz, Dejan Markovic...