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CLEIEJ
2010
13 years 7 months ago
3D-Via Driven Partitioning for 3D VLSI Integrated Circuits
A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. Howeve...
Sandro Sawicki, Gustavo Wilke, Marcelo O. Johann, ...
ISCAS
2007
IEEE
90views Hardware» more  ISCAS 2007»
14 years 4 months ago
Leakage-Aware Design of Nanometer SoC
– In the sub-65 nm CMOS technologies, subthreshold and gate dielectric leakage currents need to be simultaneously suppressed for effective energy reduction. New low-leakage circu...
Volkan Kursun, Sherif A. Tawfik, Zhiyu Liu
GLVLSI
2000
IEEE
110views VLSI» more  GLVLSI 2000»
14 years 2 months ago
A sensitivity based placer for standard cells
We present a new timing driven method for global placement. Our method is based on the observation that similar net length reductions in the different nets that make up a path may...
Bill Halpin, C. Y. Roger Chen, Naresh Sehgal
DAC
1999
ACM
14 years 11 months ago
Gate-Level Design Exploiting Dual Supply Voltages for Power-Driven Applications
The advent of portable and high-density devices has made power consumption a critical design concern. In this paper, we address the problem of reducing power consumption via gate-...
Ching-Wei Yeh, Min-Cheng Chang, Shih-Chieh Chang, ...
ICCAD
2002
IEEE
109views Hardware» more  ICCAD 2002»
14 years 6 months ago
Methods for true power minimization
This paper presents methods for efficient power minimization at circuit and micro-architectural levels. The potential energy savings are strongly related to the energy profile of ...
Robert W. Brodersen, Mark Horowitz, Dejan Markovic...