While the number of transistors on a chip increases exponentially over time, the productivity that can be realized from these systems has not kept pace. To deal with the complexit...
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
In this paper, we present an approach for automatic synthesis of System on Chip (SoC) multiprocessor architectures for applications expressed as process networks. Our approach is ...
Basant Kumar Dwivedi, Anshul Kumar, M. Balakrishna...