A 3D Heterogeneous Sensor using a stacked chip is investigated. Optical Active Pixel Sensor and IR Bolometer detectors are combined to create a multispectral pixel for aligned col...
Research on Networks on Chips (NoCs) has spanned over a decade and its results are now visible in some products. Thus the seminal idea of using networking technology to address th...
Giovanni De Micheli, Ciprian Seiculescu, Srinivasa...
A physically compact, low cost, high performance 3D graphics accelerator is presented. It supports shaded rendering of triangles and antialiased lines into a double-buffered 24-bi...
As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate threedimensional interconnect models. In this paper, we describe...
Nuno Alexandre Marques, Mattan Kamon, Jacob White,...
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...