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ICCD
2005
IEEE
221views Hardware» more  ICCD 2005»
14 years 4 months ago
Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
Brock J. LaMeres, Sunil P. Khatri
CODES
2009
IEEE
14 years 2 months ago
A high-level virtual platform for early MPSoC software development
Multiprocessor System-on-Chips (MPSoCs) are nowadays widely used, but the problem of their software development persists to be one of the biggest challenges for developers. Virtua...
Jianjiang Ceng, Weihua Sheng, Jerónimo Cast...
ISLPED
1995
ACM
131views Hardware» more  ISLPED 1995»
13 years 11 months ago
Guarded evaluation: pushing power management to logic synthesis/design
The need to reduce the power consumption of the next generation of digital systems is clearly recognized. At the system level, power management is a very powerful technique and de...
Vivek Tiwari, Sharad Malik, Pranav Ashar
TECS
2008
122views more  TECS 2008»
13 years 7 months ago
Quantitative analysis of the speed/accuracy trade-off in transaction level modeling
tion. Transaction Level Modeling (TLM) has been proposed to abstract communication for highspeed system simulation and rapid design space exploration. Although being widely accepte...
Gunar Schirner, Rainer Dömer
ICCD
2006
IEEE
148views Hardware» more  ICCD 2006»
14 years 4 months ago
Trends and Future Directions in Nano Structure Based Computing and Fabrication
— As silicon CMOS devices are scaled down into the nanoscale regime, new challenges at both the device and system level are arising. While some of these challenges will be overco...
R. Iris Bahar