Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
Multiprocessor System-on-Chips (MPSoCs) are nowadays widely used, but the problem of their software development persists to be one of the biggest challenges for developers. Virtua...
The need to reduce the power consumption of the next generation of digital systems is clearly recognized. At the system level, power management is a very powerful technique and de...
tion. Transaction Level Modeling (TLM) has been proposed to abstract communication for highspeed system simulation and rapid design space exploration. Although being widely accepte...
— As silicon CMOS devices are scaled down into the nanoscale regime, new challenges at both the device and system level are arising. While some of these challenges will be overco...