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ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
16 years 1 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
DATE
2009
IEEE
121views Hardware» more  DATE 2009»
15 years 11 months ago
Remote measurement of local oscillator drifts in FlexRay networks
—Distributed systems, especially time-triggered ones, are implementing clock synchronization algorithms to provide and maintain a common view of time among the different nodes. S...
Eric Armengaud, Andreas Steininger
GLOBECOM
2009
IEEE
15 years 11 months ago
Development Framework for Implementing FPGA-Based Cognitive Network Nodes
—This paper identifies important features a cognitive radio framework should provide, namely a virtual architecture ware abstraction, an adaptive run-time system for managing co...
Jorg Lotze, Suhaib A. Fahmy, Juanjo Noguera, Baris...
ICDCS
2007
IEEE
15 years 11 months ago
Deploying Video-on-Demand Services on Cable Networks
— Efficient video-on-demand (VoD) is a highly desired service for media and telecom providers. VoD allows subscribers to view any item in a large media catalog nearly-instantane...
Matthew S. Allen, Ben Y. Zhao, Richard Wolski
133
Voted
ISQED
2007
IEEE
206views Hardware» more  ISQED 2007»
15 years 11 months ago
Provisioning On-Chip Networks under Buffered RC Interconnect Delay Variations
Abstract—A Network-on-Chip (NoC) replaces on-chip communication implemented by point-to-point interconnects in a multi-core environment by a set of shared interconnects connected...
Mosin Mondal, Tamer Ragheb, Xiang Wu, Adnan Aziz, ...