— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
—Distributed systems, especially time-triggered ones, are implementing clock synchronization algorithms to provide and maintain a common view of time among the different nodes. S...
—This paper identifies important features a cognitive radio framework should provide, namely a virtual architecture ware abstraction, an adaptive run-time system for managing co...
Jorg Lotze, Suhaib A. Fahmy, Juanjo Noguera, Baris...
— Efficient video-on-demand (VoD) is a highly desired service for media and telecom providers. VoD allows subscribers to view any item in a large media catalog nearly-instantane...
Abstract—A Network-on-Chip (NoC) replaces on-chip communication implemented by point-to-point interconnects in a multi-core environment by a set of shared interconnects connected...