125 search results - page 5 / 25 » Tera-scale computing and interconnect challenges |
SC
2005
ACM
14 years 4 days ago
2005
ACM
We address the problem of how to exploit optics for ultrascale High Performance Computing interconnect fabrics. We show that for high port counts these fabrics require multistage ...
DAC
2002
ACM
14 years 7 months ago
2002
ACM
The next generation of computer chips will continue the trend for more complexity than their predecessors. Many of them will contain different chip technologies and are termed SoC...
ISCAS
2008
IEEE
14 years 1 months ago
2008
IEEE
— By using self-assembling fabrication techniques at the cellular, molecular, or atomic scale, it is nowadays possible to create functional assemblies in a mainly bottom-up way t...
DATE
2006
IEEE
14 years 19 days ago
2006
IEEE
Increasing miniaturization is posing multiple challenges to electronic designers. In the context of Multi-Processor System-onChips (MPSoCs), we focus on the problem of implementin...
VLSID
2006
IEEE
14 years 7 months ago
2006
IEEE
SoC design methodologies are under constant revision due to adoption of fast shrinking process technologies at nanometer levels. Nanometer process geometries exhibit new complex d...