980 search results - page 172 / 196 » The Architecture Tradeoff Analysis Method |
DAC
2009
ACM
14 years 8 months ago
2009
ACM
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated...
RTSS
2006
IEEE
14 years 1 months ago
2006
IEEE
Caches have become invaluable for higher-end architectures to hide, in part, the increasing gap between processor speed and memory access times. While the effect of caches on timi...
DAC
2004
ACM
13 years 11 months ago
2004
ACM
The ability to control the variations in IC fabrication process is rapidly diminishing as feature sizes continue towards the sub-100 nm regime. As a result, there is an increasing...
DAC
2011
ACM
12 years 7 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
DAC
2002
ACM
14 years 8 months ago
2002
ACM
For present-day micro-electronic designs, it is becoming ever more important to accurately model substrate coupling effects. Basically, either a Finite Element Method (FEM) or a B...