193 search results - page 30 / 39 » The Capacitated m-Ring-Star Problem |
DAC
2003
ACM
14 years 9 months ago
2003
ACM
Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local ...
ICCAD
2002
IEEE
14 years 5 months ago
2002
IEEE
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...
GLVLSI
2009
IEEE
14 years 3 months ago
2009
IEEE
The interconnection delay of pre-fabricated design style dominates circuit delay due to the heavily downstream capacitance. Buffer insertion is a widely used technique to split o...
INFOCOM
2008
IEEE
14 years 2 months ago
2008
IEEE
Abstract—MPLS recovery mechanisms are increasing in popularity because they can guarantee fast restoration and high QoS assurance. Their main advantage is that their backup paths...
ISCC
2005
IEEE
14 years 2 months ago
2005
IEEE
This study deals with the Delay-Constrained Minimum Cost Loop Problem (DC-MCLP) of finding several loops from a source node. The DC-MCLP consists of finding a set of minimum cost ...