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DATE
2010
IEEE
14 years 20 days ago
2010
IEEE
Today, due to the increasing demand for more and more complex applications in the consumer electronic market segment, Systems-on-Chip consist of many processing elements and becom...
AOSE
2005
Springer
14 years 1 months ago
2005
Springer
Abstract. Current Agent-Oriented Software Engineering (AOSE) methodologies adopt a model-based approach for analysis and design, but, in order to become of practical use, they shou...
DAC
2009
ACM
14 years 8 months ago
2009
ACM
Within-die variation in leakage power consumption is substantial and increasing for chip-level multiprocessors (CMPs) and multiprocessor systems-on-chip. Dealing with this problem...
DAC
2010
ACM
13 years 11 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
ISCA
2008
IEEE
14 years 2 months ago
2008
IEEE
Performance improvement solely through transistor scaling is becoming more and more difficult, thus it is increasingly common to see domain specific accelerators used in conjunc...