174 search results - page 17 / 35 » The Design of High-Performance Microprocessors at Digital |
IFIPPACT
1994
13 years 9 months ago
1994
: Advanced architectural features of microprocessors like instruction level parallelism and pipelined functional hardware units require code generation techniques beyond the scope ...
HPCA
1998
IEEE
13 years 12 months ago
1998
IEEE
The explosive growth in the performance of microprocessors and networks has created a new opportunity to reduce the latency of fine-grain communication. Microprocessor clock speed...
DATE
2007
IEEE
14 years 2 months ago
2007
IEEE
The ability to guarantee the functional correctness of digital integrated circuits and, in particular, complex microprocessors, is a key task in the production of secure and trust...
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
DAC
2003
ACM
14 years 8 months ago
2003
ACM
In the way they cope with variability, present-day methodologies are onerous, pessimistic and risky, all at the same time! Dealing with variability is an increasingly important as...