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VISUALIZATION
2005
IEEE
14 years 1 months ago
2005
IEEE
We present Build-by-Number, a technique for quickly designing architectural structures that can be rendered photorealistically at interactive rates. We combine image-based capturi...
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
SIGIR
2010
ACM
13 years 11 months ago
2010
ACM
It is generally believed that propagated anchor text is very important for effective Web search as offered by the commercial search engines. “Google Bombs” are a notable illus...
SAS
2009
Springer
14 years 8 months ago
2009
Springer
The Java programming language requires that out-of-bounds array accesses produce runtime exceptions. In general, this requires a dynamic bounds check each time an array element is...
DAC
2002
ACM
14 years 8 months ago
2002
ACM
The next generation of computer chips will continue the trend for more complexity than their predecessors. Many of them will contain different chip technologies and are termed SoC...