We have developed a new 3-dimensional stacking technology using wafer-to-wafer stacked method and evaluated the connectivity between TSV and micro-bump. The prototype 3-layer stac...
: This paper presents a conceptual analysis of the technological dimensions related to the operationalization of CSCL macro-scripts. CSCL scripts are activity models that aim at en...
Standardisation of learning technologies as a coordinated design activity needs legitimacy to attract the necessary support from its stakeholders. This paper identifies the need f...
This paper presents a comparison between two technologies for reconfigurable circuits that are FPGA'se the FPAA's. The comparison is based on a case study of the area of...
Roberto Selow, Heitor S. Lopes, Carlos R. Erig Lim...
Domino logic is a popular con guration for implementing high-speed circuits. An algorithm for domino logic mapping, under a parameterized library style, is presented here. Practic...