104 search results - page 11 / 21 » Thermal Characterization and Thermal Management in Processor... |
DATE
2006
IEEE
14 years 1 months ago
2006
IEEE
The existence of non-uniform thermal gradients on the substrate in high performance IC’s can significantly impact the performance of global on-chip interconnects. This issue is...
DAC
2008
ACM
14 years 8 months ago
2008
ACM
In deep submicron circuits, thermal hot spots and high temperature gradients increase the cooling costs, and degrade reliability and performance. In this paper, we propose a low-co...
FPL
1997
Springer
14 years 2 hour ago
1997
Springer
In this paper, a temperature-to-frequency transducer suitable for thermal monitoring on FPGAs is presented. The dependence between delay and temperature is used to produce a freque...
DATE
2007
IEEE
14 years 2 months ago
2007
IEEE
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...
ICCD
2008
IEEE
14 years 4 months ago
2008
IEEE
— Clock frequency and transistor density increases have resulted in elevated chip temperatures. In order to meet temperature constraints while still exploiting the performance op...