1476 search results - page 221 / 296 » Three-dimensional integrated circuits |
FPGA
2003
ACM
14 years 3 months ago
2003
ACM
This paper presents a new power saving, high speed FPGA design enhancing a previous SiGe CML FPGA based on the Xilinx 6200 FPGA. The design aims at having a higher performance but...
KDD
2000
ACM
14 years 1 months ago
2000
ACM
We describe an application of data mining and decision analysis to the problem of die-level functional test in integrated circuit manufacturing. Integrated circuits are fabricated...
DAC
2005
ACM
14 years 4 days ago
2005
ACM
Implementing logic blocks in an integrated circuit in terms of repeating or regular geometry patterns [6,7] can provide significant advantages in terms of manufacturability and de...
DAC
2010
ACM
13 years 8 months ago
2010
ACM
Integrating a large number of on-chip voltage regulators holds the promise of solving many power delivery challenges through strong local load regulation and facilitates systemlev...
DAC
2011
ACM
12 years 10 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...