1476 search results - page 288 / 296 » Three-dimensional integrated circuits |
FPGA
2003
ACM
14 years 2 months ago
2003
ACM
How does multilevel metalization impact the design of FPGA interconnect? The availability of a growing number of metal layers presents the opportunity to use wiring in the thirddi...
ISCA
2010
IEEE
14 years 2 months ago
2010
IEEE
Continued device scaling enables microprocessors and other systems-on-chip (SoCs) to increase their performance, functionality, and hence, complexity. Simultaneously, relentless s...
ASAP
2002
IEEE
14 years 1 months ago
2002
IEEE
With the growth of the Internet and mobile communication industry, multimedia applications form a dominant computer workload. Media workloads are typically executed on Application...
VLSID
1998
IEEE
14 years 1 months ago
1998
IEEE
With several commercial tools becoming available, the high-level synthesis of applicationspeci c integrated circuits is nding wide spread acceptance in VLSI industry today. Existi...
ASPDAC
2007
ACM
14 years 28 days ago
2007
ACM
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...