1476 search results - page 29 / 296 » Three-dimensional integrated circuits |
ICCD
2007
IEEE
14 years 4 months ago
2007
IEEE
Scan chains are widely used to improve the testability of IC designs. In traditional 2D IC designs, various design techniques on the construction of scan chains have been proposed...
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
ICCAD
2008
IEEE
14 years 4 months ago
2008
IEEE
—To overcome the energy-efficiency limitations imposed by finite sub-threshold slope in CMOS transistors, this paper explores the design of integrated circuits based on nanoelect...
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
ISCAS
2008
IEEE
14 years 2 months ago
2008
IEEE
—We present experimental results from an integrated circuit designed for wireless neural recording applications. The chip, which was fabricated in a 0.6-µm 2P3M BiCMOS process, ...