1476 search results - page 34 / 296 » Three-dimensional integrated circuits |
3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
DSD
2007
IEEE
14 years 2 months ago
2007
IEEE
This paper presents an optimized fault diagnosing procedure applicable in Built-in Self-Test environments. Instead of the known approach based on a simple bisection of patterns in...
ICCAD
2005
IEEE
14 years 1 months ago
2005
IEEE
Suppression of leakage current and reduction in device-todevice variability will be key challenges for sub-45nm CMOS technologies. Non-classical transistor structures such as the ...
GLVLSI
2003
IEEE
14 years 1 months ago
2003
IEEE
Decreasing feature sizes and increasing package densities are making thermal issues extremely important in IC design. Uneven thermal maps and hot spots in ICs cause physical stres...
ISQED
2002
IEEE
14 years 21 days ago
2002
IEEE
— The inductive characteristics of several types of gridded power distribution networks are described in this paper. The inductance extraction program FastHenry is used to evalua...