1476 search results - page 55 / 296 » Three-dimensional integrated circuits |
AHS
2007
IEEE
13 years 11 months ago
2007
IEEE
Fault Tolerance is an increasing challenge for integrated circuits due to semiconductor technology scaling. This paper looks at how artificial evolution may be tuned to the creat...
DAC
2007
ACM
14 years 10 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
DAC
1999
ACM
14 years 1 months ago
1999
ACM
In this survey paper we describethe combination of: discretized integral formulations, sparsication techniques, and krylov-subspace based model-order reduction that has led to rob...
CASES
2010
ACM
13 years 6 months ago
2010
ACM
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
DAC
2004
ACM
14 years 10 months ago
2004
ACM
Programmable circuit design has played an important role in improving design productivity over the last few decades. By imposing structure on the design, efficient automation of s...