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3DIC
2009
IEEE
169views Hardware» more  3DIC 2009»
14 years 3 months ago
3-D memory organization and performance analysis for multi-processor network-on-chip architecture
Several forms of processor memory organizations have been in use to optimally access off-chip memory systems mainly the Hard disk drives (HDD). Recent trends show that the solid s...
Awet Yemane Weldezion, Zhonghai Lu, Roshan Weerase...
DATE
2010
IEEE
131views Hardware» more  DATE 2010»
14 years 3 months ago
Ultra-low power mixed-signal design platform using subthreshold source-coupled circuits
Abstract—This article discusses system-level techniques to optimize the power-performance trade-off in subthreshold circuits and presents a uniform platform for implementing ultr...
Armin Tajalli, Yusuf Leblebici
ASPDAC
1999
ACM
107views Hardware» more  ASPDAC 1999»
14 years 3 months ago
New Multilevel and Hierarchical Algorithms for Layout Density Control
Certain manufacturing steps in very deep submicron VLSI involve chemical-mechanical polishing CMP which has varying e ects on device and interconnect features, depending on loca...
Andrew B. Kahng, Gabriel Robins, Anish Singh, Alex...
ICCAD
1997
IEEE
147views Hardware» more  ICCAD 1997»
14 years 3 months ago
Built-in test generation for synchronous sequential circuits
We consider the problem of built-in test generation for synchronous sequential circuits. The proposed scheme leaves the circuit flip-flops unmodified, and thus allows at-speed ...
Irith Pomeranz, Sudhakar M. Reddy
3DIC
2009
IEEE
178views Hardware» more  3DIC 2009»
14 years 2 months ago
Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs
This paper presents an analysis and comparison between synchronous and delay-insensitive asynchronous logic circuits on thermal distributions for investigating novel solutions to t...
Brent Hollosi, Tao Zhang, Ravi Sankar Parameswaran...