Sciweavers

159 search results - page 31 / 32
» User- and process-driven dynamic voltage and frequency scali...
Sort
View
ISCA
2007
IEEE
113views Hardware» more  ISCA 2007»
14 years 1 months ago
Thermal modeling and management of DRAM memory systems
With increasing speed and power density, high-performance memories, including FB-DIMM (Fully Buffered DIMM) and DDR2 DRAM, now begin to require dynamic thermal management (DTM) a...
Jiang Lin, Hongzhong Zheng, Zhichun Zhu, Howard Da...
MICRO
2007
IEEE
150views Hardware» more  MICRO 2007»
14 years 1 months ago
Leveraging 3D Technology for Improved Reliability
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
Niti Madan, Rajeev Balasubramonian
CODES
2005
IEEE
14 years 1 months ago
DVS for buffer-constrained architectures with predictable QoS-energy tradeoffs
We present a new scheme for dynamic voltage and frequency scaling (DVS) for processing multimedia streams on architectures with restricted buffer sizes. The main advantage of our ...
Alexander Maxiaguine, Samarjit Chakraborty, Lothar...
NOCS
2010
IEEE
13 years 5 months ago
Asynchronous Bypass Channels: Improving Performance for Multi-synchronous NoCs
Abstract--Networks-on-Chip (NoC) have emerged as a replacement for traditional shared-bus designs for on-chip communications. As with all current VLSI designs, however, reducing po...
Tushar N. K. Jain, Paul V. Gratz, Alexander Sprint...
MJ
2011
288views Multimedia» more  MJ 2011»
13 years 2 months ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza