The impact of power supply integrity on a design has become a critical issue, not only for functional verification, but also for performance verification. Traditional analysis has...
Sanjay Pant, David Blaauw, Vladimir Zolotov, Savit...
On-chip global interconnections in very deep submicron technology (VDSM) ICs are becoming more sensitive and prone to errors caused by power supply noise, crosstalk noise, delay v...
Daniele Rossi, Steven V. E. S. van Dijk, Richard P...
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, ...
As technology scales toward deep submicron, on-chip interconnects are becoming more and more sensitive to noise sources such as power supply noise, crosstalk, radiation induced ef...