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SOCA
2010
IEEE
15 years 1 months ago
MaDe4IC: an abstract method for managing model dependencies in inter-organizational cooperations
Lianne Bodenstaff, Andreas Wombacher, Manfred Reic...
ICCAD
2010
IEEE
139views Hardware» more  ICCAD 2010»
15 years 1 months ago
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Categories and Subject Descriptors Keywords .
Arvind Sridhar, Alessandro Vincenzi, Martino Ruggi...
GLVLSI
2010
IEEE
161views VLSI» more  GLVLSI 2010»
15 years 7 months ago
Electromagnetic interaction of on-chip antennas and CMOS metal layers for wireless IC interconnects
The electromagnetic interaction of on-chip antennas and metal interconnects modeled in a 250 nm complementary metal-oxide semiconductor (CMOS) technology is investigated. A finite...
Ankit More, Baris Taskin
TE
2010
119views more  TE 2010»
14 years 10 months ago
Innovative Teaching of IC Design and Manufacture Using the Superchip Platform
This paper describes how an intelligent chip architecture has allowed a large cohort of undergraduate students to be given effective practical insight into IC design, by designing ...
Peter R. Wilson, Reuben Wilcock, Iain McNally, Mat...