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ICCAD
2010
IEEE
139views Hardware» more  ICCAD 2010»
13 years 7 months ago
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Categories and Subject Descriptors Keywords .
Arvind Sridhar, Alessandro Vincenzi, Martino Ruggi...
GLVLSI
2010
IEEE
161views VLSI» more  GLVLSI 2010»
14 years 2 months ago
Electromagnetic interaction of on-chip antennas and CMOS metal layers for wireless IC interconnects
The electromagnetic interaction of on-chip antennas and metal interconnects modeled in a 250 nm complementary metal-oxide semiconductor (CMOS) technology is investigated. A finite...
Ankit More, Baris Taskin
TE
2010
119views more  TE 2010»
13 years 4 months ago
Innovative Teaching of IC Design and Manufacture Using the Superchip Platform
This paper describes how an intelligent chip architecture has allowed a large cohort of undergraduate students to be given effective practical insight into IC design, by designing ...
Peter R. Wilson, Reuben Wilcock, Iain McNally, Mat...