MR
2007
13 years 11 months ago
2007
The development of a simplified analytical model to describe the thermal history of a Printed Circuit Board assembly (PCA) during convective reflow soldering is described in this ...
TROB
2002
13 years 11 months ago
2002
Dynamic control of constrained mechanical systems, such as robotic manipulators under end-effector constraints, parallel manipulators, and multifingered robotic hands under closure...
MR
2002
13 years 11 months ago
2002
MR
2002
13 years 11 months ago
2002
Generally, tantalum capacitor failure modes have been discussed both for the standard manganese dioxide cathode and the new conductive polymer (CP) type. For standard tantalum in ...
MR
2002
13 years 11 months ago
2002
- This paper discusses the previously unexplored initial front rise differences between Real HBM, TLP and HBM tester waveshapes. The dV/dt of the HBM test pulse amplitude below 2% ...
MR
2002
13 years 11 months ago
2002
This paper reviews the main failure mechanisms occurring in modern power modules paying special attention to insulated gate bipolar transistor devices for high-power applications....
MR
2002
13 years 11 months ago
2002
MR
2002
13 years 11 months ago
2002
Experiments are described in this paper whose results suggest a clear mathematical relationship between total circuit resistance (including the capacitor's ESR) and the volta...
MR
2002
13 years 11 months ago
2002
This paper presents an approach to the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analy...
MR
2002
13 years 11 months ago
2002
In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...