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MR
2006
73views Robotics» more  MR 2006»
13 years 11 months ago
Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs
Deuterated oxides exhibit prolonged hot carrier lifetimes at room temperature. We report evidence that this improved hot carrier hardness exists over the temperature range between...
Cora Salm, André J. Hof, Fred G. Kuper, Jur...
MR
2006
58views Robotics» more  MR 2006»
13 years 11 months ago
Drop impact reliability testing for lead-free and lead-based soldered IC packages
Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization...
Desmond Y. R. Chong, F. X. Che, John H. L. Pang, K...
MR
2006
73views Robotics» more  MR 2006»
13 years 11 months ago
Reliability of large periphery GaN-on-Si HFETs
S. Singhal, T. Li, A. Chaudhari, A. W. Hanson, R. ...
MR
2006
92views Robotics» more  MR 2006»
13 years 11 months ago
Failure mechanism of trench IGBT under short-circuit after turn-off
Power semiconductor devices under short-circuit are submitted to high current and high voltage simultaneously that induce high electrical and thermal stresses. Several types of ev...
A. Benmansour, Stephane Azzopardi, J. C. Martin, E...
MR
2006
57views Robotics» more  MR 2006»
13 years 11 months ago
Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading
Interface reliability issue has become a major concern in developing flip chip assembly. The CTE mismatch between different material layers may induce severe interface delaminatio...
Y. L. Zhang, D. X. Q. Shi, W. Zhou
MR
2006
74views Robotics» more  MR 2006»
13 years 11 months ago
Lock-in thermal IR imaging using a solid immersion lens
A hemispherical silicon solid immersion lens (SIL) was used to improve the spatial resolution of front-side thermal IR imaging in lock-in mode. The bottom of the SIL was cone-shap...
O. Breitenstein, F. Altmann, T. Riediger, D. Karg,...
MR
2006
71views Robotics» more  MR 2006»
13 years 11 months ago
High-temperature reliability of Flip Chip assemblies
T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf As...