ESD protection design for CMOS RF integrated circuits is proposed in this paper by using the stacked polysilicon diodes as the input ESD protection devices to reduce the total inp...
Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs)....
Anisotropic conductive adhesive film (ACF) has been extensively used in the liquid crystal display (LCD) industry for decades on chip-on-glass (COG) applications. It offers the ad...
Over the past three decades, tactile sensing has developed into a sophisticated technology. There has been a longstanding and widely held expectation that tactile sensors would ha...
The field of robotics moves so quickly and encompasses such a wide range of disciplines and applications that education in robotics must be adaptive and incorporate a multidiscipl...
With the explosive growth of embedded computing hardware, it is possible to conceive many new networked robotic applications for diverse domains ranging from urban search and resc...
New Robotics designates an approach to robotics that, in contrast to traditional robotics, employs ideas and principles from biology. While in the traditional approach there are g...
Commercial-off-the-shelf (COTS) area array packaging technologies in high reliability versions are now being considered for applications, including use in a number of NASA electro...
The electrostatic discharge (ESD) robustness of different thin-film devices, including three diodes and two thin-film transistors (TFTs) in low-temperature polysilicon (LTPS) tech...
The intrinsic failure mechanisms and reliability models of state-of-the-art MOSFETs are reviewed. The simulation tools and failure equivalent circuits are described. The review in...
Joseph B. Bernstein, Moshe Gurfinkel, Xiaojun Li, ...