Process variations have become a serious concern for nanometer technologies. The interconnect and device variations include interand intra-die variations of geometries, as well as...
Xiaoning Qi, Alex Gyure, Yansheng Luo, Sam C. Lo, ...
We present the design of high-performance and energy-efficient dynamic instruction schedulers in a 3-Dimensional integration technology. Based on a previous observation that the c...
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
This paper presents a systematic design methodology for yield enhancement of asynchronous logic circuits using 3-D (3-Dimensional) integration technology. In this design, the targ...
As CMOS devices and operating voltages are scaled down, noise and defective devices will impact the reliability of digital circuits. Probabilistic computing compatible with CMOS o...
Kundan Nepal, R. Iris Bahar, Joseph L. Mundy, Will...
Process variations have become a key concern of circuit designers because of their significant, yet hard to predict impact on performance and signal integrity of VLSI circuits. St...
In this paper we have applied statistical sizing in an industrial setting. Efficient implementation of the statistical sizing algorithm is achieved by utilizing a dedicated interi...
Functional verification is one of the major bottlenecks in microprocessor design. Simulation-based techniques are the most widely used form of processor verification. Efficient ...