ing models and HW-SW Interfaces Abstraction for Multi-Processor SoC Ahmed A. Jerraya TIMA Laboratory 46 Ave Felix Viallet 38031 Grenoble CEDEX, France +33476574759 Ahmed.Jerraya@im...
The increasing use of Multiprocessor Systems-on-Chip (MPSoCs) for high performance demands of embedded applications results in high power dissipation. The memory subsystem is a la...
Ilya Issenin, Erik Brockmeyer, Bart Durinck, Nikil...
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
Field programmable dual-Vdd interconnects are effective to reduce FPGA power. Assuming uniform length interconnects, existing work has developed time slack budgeting to minimize p...
As a prevalent constraint, sharp slew rate is often required in circuit design which causes a huge demand for buffering resources. This problem requires ultra-fast buffering techn...
Shiyan Hu, Charles J. Alpert, Jiang Hu, Shrirang K...
Simulation and verification using electronic design automation (EDA) tools are key steps in the design process for communication and signal processing systems. The synchronous dat...