Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
Thermal management of DRAM memory has become a critical issue for server systems. We have done, to our best knowledge, the first study of software thermal management for memory su...
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...
We have developed a system architecture, measuring and modeling techniques, and algorithms for on-line power and energy optimization and thermal management. The starting point for...
Increasing power density in computing systems from laptops to servers has spurred interest in dynamic thermal management. Based on the success of dynamic voltage and frequency sca...
Heather Hanson, Stephen W. Keckler, Soraya Ghiasi,...
Given large circuit sizes, high clock frequencies, and possibly extreme operating environments, Field Programmable Gate Arrays (FPGAs) are capable of heating beyond their designed...
Meeting the temperature constraints and reducing the hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. The goal of thermal mana...
Francesco Zanini, David Atienza, Giovanni De Miche...
As energy consumption in high-performance systems has increased, thermal management has become a big challenge. Providing a cost-effective and detailed temperature sensing mechani...
Power densities have been increasing rapidly at all levels of server systems. To counter the high temperatures resulting from these densities, systems researchers have recently st...
Taliver Heath, Ana Paula Centeno, Pradeep George, ...