RTCSA
2009
IEEE
14 years 6 months ago
2009
IEEE
Distributed real-time embedded systems have stringent requirements for key performance properties, such as endto-end timeliness and reliability, in order to operate properly. In r...
DATE
2009
IEEE
14 years 6 months ago
2009
IEEE
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
DATE
2009
IEEE
14 years 6 months ago
2009
IEEE
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
DATE
2009
IEEE
14 years 6 months ago
2009
IEEE
—Dynamic Thermal Management techniques have been widely accepted as a thermal solution for their low cost and simplicity. The techniques have been used to manage the heat dissipa...
ISPASS
2009
IEEE
14 years 6 months ago
2009
IEEE
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
ASPLOS
2010
ACM
14 years 6 months ago
2010
ACM
Temperature is a dominant factor in the performance, reliability, and leakage power consumption of modern processors. As a result, increasing numbers of researchers evaluate therm...