Sciweavers

ISCAS
2006
IEEE
112views Hardware» more  ISCAS 2006»
14 years 5 months ago
Fine-grain thermal profiling and sensor insertion for FPGAs
– Increasing logic densities and clock frequencies on FPGAs lead to rapid increase in power density, which translates to higher on-chip temperature. In this paper, we investigate...
Somsubhra Mondal, Rajarshi Mukherjee, Seda Ogrenci...
ISQED
2007
IEEE
236views Hardware» more  ISQED 2007»
14 years 5 months ago
3DFFT: Thermal Analysis of Non-Homogeneous IC Using 3D FFT Green Function Method
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
Dongkeun Oh, Charlie Chung-Ping Chen, Yu Hen Hu
ISQED
2007
IEEE
127views Hardware» more  ISQED 2007»
14 years 5 months ago
Thermal vs Energy Optimization for DVFS-Enabled Processors in Embedded Systems
— In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power and energy optimization in embedded system design. As thermal issues become increasingl...
Yongpan Liu, Huazhong Yang, Robert P. Dick, Hui Wa...
ISCA
2007
IEEE
113views Hardware» more  ISCA 2007»
14 years 5 months ago
Thermal modeling and management of DRAM memory systems
With increasing speed and power density, high-performance memories, including FB-DIMM (Fully Buffered DIMM) and DDR2 DRAM, now begin to require dynamic thermal management (DTM) a...
Jiang Lin, Hongzhong Zheng, Zhichun Zhu, Howard Da...
ICPP
2007
IEEE
14 years 5 months ago
Tempest: A portable tool to identify hot spots in parallel code
Compute clusters are consuming more power at higher densities than ever before. This results in increased thermal dissipation, the need for powerful cooling systems, and ultimatel...
Kirk W. Cameron, Hari K. Pyla, Srinidhi Varadaraja...
CODES
2007
IEEE
14 years 5 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
ISPASS
2008
IEEE
14 years 6 months ago
Dynamic Thermal Management through Task Scheduling
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...
Jun Yang 0002, Xiuyi Zhou, Marek Chrobak, Youtao Z...
IPPS
2008
IEEE
14 years 6 months ago
Measuring power and temperature from real processors
The modeling of power and thermal behavior of modern processors requires challenging validation approaches, which may be complex and in some cases unreliable. In order to address ...
Francisco J. Mesa-Martinez, Michael Brown, Joseph ...
ASPDAC
2009
ACM
152views Hardware» more  ASPDAC 2009»
14 years 6 months ago
A control theory approach for thermal balancing of MPSoC
— Thermal balancing and reducing hot-spots are two important challenges facing the MPSoC designers. In this work, we model the thermal behavior of a MPSoC as a control theory pro...
Francesco Zanini, David Atienza, Giovanni De Miche...
APPT
2009
Springer
14 years 6 months ago
A Fast Scheme to Investigate Thermal-Aware Scheduling Policy for Multicore Processors
Abstract. With more cores integrated into one single chip, the overall power consumption from the multiple concurrent running programs increases dramatically in a CMP processor whi...
Liqiang He, Cha Narisu