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ISLPED
2007
ACM
169views Hardware» more  ISLPED 2007»
14 years 1 months ago
Throughput of multi-core processors under thermal constraints
We analyze the effect of thermal constraints on the performance and power of multi-core processors. We propose system-level power and thermal models, and derive expressions for (a...
Ravishankar Rao, Sarma B. K. Vrudhula, Chaitali Ch...
ISLPED
2007
ACM
132views Hardware» more  ISLPED 2007»
14 years 1 months ago
Thermal response to DVFS: analysis with an Intel Pentium M
Increasing power density in computing systems from laptops to servers has spurred interest in dynamic thermal management. Based on the success of dynamic voltage and frequency sca...
Heather Hanson, Stephen W. Keckler, Soraya Ghiasi,...
ASPDAC
2008
ACM
130views Hardware» more  ASPDAC 2008»
14 years 1 months ago
Architecture-level thermal behavioral characterization for multi-core microprocessors
In this paper, we investigate a new architecture-level thermal characterization problem from behavioral modeling perspective to address the emerging thermal related analysis and o...
Duo Li, Sheldon X.-D. Tan, Murli Tirumala
FPL
2006
Springer
140views Hardware» more  FPL 2006»
14 years 3 months ago
A Thermal Management and Profiling Method for Reconfigurable Hardware Applications
Given large circuit sizes, high clock frequencies, and possibly extreme operating environments, Field Programmable Gate Arrays (FPGAs) are capable of heating beyond their designed...
Phillip H. Jones, John W. Lockwood, Young H. Cho
DATE
2004
IEEE
130views Hardware» more  DATE 2004»
14 years 3 months ago
Thermal and Power Integrity Based Power/Ground Networks Optimization
With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and power integrity has become serious concern. Although the impacts of thermal effects...
Ting-Yuan Wang, Jeng-Liang Tsai, Charlie Chung-Pin...
ASPDAC
2006
ACM
148views Hardware» more  ASPDAC 2006»
14 years 3 months ago
TAPHS: thermal-aware unified physical-level and high-level synthesis
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
Zhenyu (Peter) Gu, Yonghong Yang, Jia Wang, Robert...
HAPTICS
2007
IEEE
14 years 3 months ago
An Experimentally Verified Model of the Perceived 'Coldness' of Objects
In this paper, a numerical model of the thermal process of touching an object is described. The model takes into account the object geometry and temperature, the thermal parameter...
Wouter M. Bergmann Tiest
EXPCS
2007
14 years 3 months ago
Measuring performance, power, and temperature from real processors
The modeling of power and thermal behavior of processors requires challenging validation processes, which may be complex and undependable. In order to ameliorate some of the diffi...
Francisco J. Mesa-Martinez, Michael Brown, Joseph ...
CASES
2007
ACM
14 years 3 months ago
Performance optimal processor throttling under thermal constraints
We derive analytically, the performance optimal throttling curve for a processor under thermal constraints for a given task sequence. We found that keeping the chip temperature co...
Ravishankar Rao, Sarma B. K. Vrudhula
NANONET
2009
Springer
199views Chemistry» more  NANONET 2009»
14 years 4 months ago
Through Silicon Via-Based Grid for Thermal Control in 3D Chips
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
José L. Ayala, Arvind Sridhar, Vinod Pangra...