We analyze the effect of thermal constraints on the performance and power of multi-core processors. We propose system-level power and thermal models, and derive expressions for (a...
Ravishankar Rao, Sarma B. K. Vrudhula, Chaitali Ch...
Increasing power density in computing systems from laptops to servers has spurred interest in dynamic thermal management. Based on the success of dynamic voltage and frequency sca...
Heather Hanson, Stephen W. Keckler, Soraya Ghiasi,...
In this paper, we investigate a new architecture-level thermal characterization problem from behavioral modeling perspective to address the emerging thermal related analysis and o...
Given large circuit sizes, high clock frequencies, and possibly extreme operating environments, Field Programmable Gate Arrays (FPGAs) are capable of heating beyond their designed...
With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and power integrity has become serious concern. Although the impacts of thermal effects...
Ting-Yuan Wang, Jeng-Liang Tsai, Charlie Chung-Pin...
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
In this paper, a numerical model of the thermal process of touching an object is described. The model takes into account the object geometry and temperature, the thermal parameter...
The modeling of power and thermal behavior of processors requires challenging validation processes, which may be complex and undependable. In order to ameliorate some of the diffi...
Francisco J. Mesa-Martinez, Michael Brown, Joseph ...
We derive analytically, the performance optimal throttling curve for a processor under thermal constraints for a given task sequence. We found that keeping the chip temperature co...
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...