—The very high levels of integration and submicron device sizes used in current and emerging VLSI technologies for FPGAs lead to higher occurrences of defects and operational fau...
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
Policing of incoming packets can produce very high load in worst-case situations on a receiving computer. In realtime systems, resources must be allocated for such worstcase situa...
With the continuing growth in the amount of genetic data, members of the bioinformatics community are developing a variety of data-mining applications to understand the data and d...
The design of high performance multimedia systems in a short time force us to use IP's blocks in many designs. However, their correct integration in a design implies more com...