420 search results - page 36 / 84 » A pseudo-hierarchical methodology for high performance micro... |
TC
1998
13 years 8 months ago
1998
—The very high levels of integration and submicron device sizes used in current and emerging VLSI technologies for FPGAs lead to higher occurrences of defects and operational fau...
MICRO
2006
IEEE
14 years 2 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
RTAS
2000
IEEE
14 years 6 days ago
2000
IEEE
Policing of incoming packets can produce very high load in worst-case situations on a receiving computer. In realtime systems, resources must be allocated for such worstcase situa...
HPCA
2006
IEEE
14 years 9 months ago
2006
IEEE
With the continuing growth in the amount of genetic data, members of the bioinformatics community are developing a variety of data-mining applications to understand the data and d...
DATE
2003
IEEE
14 years 1 months ago
2003
IEEE
The design of high performance multimedia systems in a short time force us to use IP's blocks in many designs. However, their correct integration in a design implies more com...