Many DTM schemes rely heavily on the accurate knowledge of the chip's dynamic thermal state to make optimal performance/ temperature trade-off decisions. This information is ...
Next generation industrial embedded platforms require the development of complex power and thermal management solutions. Indeed, an increasingly fine and intrusive thermal contro...
Andrea Acquaviva, Andrea Calimera, Alberto Macii, ...
FPGA logic densities continue to increase at a tremendous rate. This has had the undesired consequence of increased power density, which manifests itself as higher ondie temperatu...
Sivakumar Velusamy, Wei Huang, John Lach, Mircea R...
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakuma...
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...