24 search results - page 2 / 5 » Adaptive multi-domain thermal modeling and analysis for inte... |
DATE
2007
IEEE
14 years 28 days ago
2007
IEEE
— It has been the conventional assumption that, due to the superlinear dependence of leakage power consumption on temperature, and widely varying on-chip temperature profiles, a...
ISLPED
2006
ACM
14 years 16 days ago
2006
ACM
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
ISQED
2007
IEEE
14 years 26 days ago
2007
IEEE
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
DAC
1994
ACM
13 years 10 months ago
1994
ACM
Manufacturing disturbances are inevitable in the fabrication of integrated circuits. These disturbances will result in variations in the delay speci cations of manufactured circui...
VLSID
2009
IEEE
14 years 7 months ago
2009
IEEE
: The challenges in nano-CMOS circuit design include the following: variability, leakage, power, thermals, reliability, and yield. This talk will focus on interdependent considerat...