65 search results - page 10 / 13 » An on Chip ADC Test Structure |
ISCAS
2006
IEEE
2006
IEEE
Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures
14 years 1 months ago
— We discuss the design of CMOS MEMS in a 3D SOI-CMOS technology. We present layout architectures, preliminary mechanics modeling using finite element analysis and release proce...
DCC
2007
IEEE
14 years 7 months ago
2007
IEEE
Instruction and data address traces are widely used by computer designers for quantitative evaluations of new architectures and workload characterization, as well as by software de...
DDECS
2007
IEEE
13 years 7 months ago
2007
IEEE
—A Low noise and low power CMOS Image Sensor (CIS) with pixel-level Correlated Double Sampling (CDS) is proposed. As the pixel readout circuit using source follower is major read...
ITC
2003
IEEE
14 years 22 days ago
2003
IEEE
Embedded memories are among the most widely used cores in current system-on-chip (SOC) implementations. Memory cores usually occupy a significant portion of the chip area, and do...
ET
2010
13 years 6 months ago
2010
Abstract As technology scales down into the nanometer era, delay testing of modern chips has become more and more important. Tests for the path delay fault model are widely used to...